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Product Information

HL-720 Automated Tube IC Lead / Mark Inspection System

HL-720Automated Tube IC Lead / Mark Inspection System
A Professional Pick & Place Lead Scanner for ICs in Tube
HL-720Automated Tube IC Lead / Mark Inspection System Data Sheet

Introduction

HL-720Automated Tube IC Lead / Mark Inspection SystemHL-720 system performs efficient and precised lead inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs in tube.

System performs mark / surface scanning with Carried CCD on Tube In spots, then pick ICs, go through Fixed CCD for lead scanning and then place ICs on Tube Out spots. Pairs of Tube In and Tube Out move units in and out by turns to eliminate pick & place wait time as well as easy tube load / unload operation.

Key features

<System function>
System performs mark / surface scanning with Carried CCD on Tube In spots, then pick ICs, go through Fixed CCD for lead scanning and then place ICs on Tube Out spots with passes / failures sorted to individual tube category. Pairs of Tube In and Tube Out move units in and out by turns to eliminate pick & place wait time and easy tube load / unload operation as well.

<Lead inspection>
System provides 3D measurements of lead pitch, lead width, lead co-planarity, lead span, lead skew, terminal dimension, standoff …etc. for SOIC, SSOP, TSSOP… packages.

<Mark / Surface inspection>
Either single marking criteria can be set for all characters or 3 different criteria can be individually set for small, medium and large characters to screen out defects of double marking, low contrast marking, voids or bleeds in the mark, broken or smeared characters...etc.
System also provides surface inspection to screen out body defects such as scratch, crack, chipout…etc.

<3D optical measurement>

The 3DX, accommodated with 3 high resolution digital cameras plus working with powerful I-Cite vision software, provides the algorithms for high speed and accurate 3D image acquiring and processing. Sub-pixel algorithms maximize accuracy of measurements to 1/4 pixel.

<High throughput>
Serialized lead / mark scanning, up to 10 units each pick & place, visual scanning on the fly without having to stop and position as well as extremely high speed image processing contribute system throughput up to ~ 8K UPH for lead and mark inspections.

<Statistical report>
System provides data collection report including yield summary, rejects summary and overall statistical summary with detailed CPK data for Process and QA engineering.

Specification

Motion X drive High performance servo drive system
Transmission Ball screw & linear guide mechanism
Resolution X axis: ±0.03mm, Z axis: ±0.02mm
Max. stroke X axis: 1168mm, Z axis: 62mm
Nozzles of Pick & Place mechanism 10 PCS
Vision Camera Fixed 3D cameras 1392 x 1040 pixels for lead inspection
Carried 2D camera 1024 x 768 pixels for mark / surface inspection
Field of view Optional 15mm x 15mm / 25mm x 25mm
Image acquiring time ~ 50 ms / image
Image processing time 30 ~ 60 ms / image
Optical process speed ~ 60K UPH (without handler index time)
3 sigma measurement accuracy 5 ~ 7 um
Applicable products Tube form SOIC, SSOP, TSSOP… etc. IC units packed in tube form
Throughput Lead scan ~ 10K UPH (assume 100% inspection yield)
Lead + Mark scan ~ 8K UPH (assume 100% inspection yield)
I/O devices Tube In Two 10-tube-wide devices mounted. 150mil, 208mil, 300mil packages available
Tube Out Two 12-tube-wide devices mounted. 10 tubes for passes, 2 tubes for lead / mark failures.
150mil, 208mil, 300mil packages available
Control Built-in controller PC based control with Windows XP
Display 17” TFT LCD touch panel
Power AC voltage 200 ~ 245V / 50-60Hz
Power consumption 1.0 KVA
Air Air pressure 0.6 Mpa (~6.0 kg/cm2)
Air consumption 50 liter/min
Dimension Base Unit (W)1550mm x(D) 750mm x (H)1600mm
with tube I/O installed (W) 1550mm x (D) 1290mm x (H) 1480mm

Inquiry

<Business Hour> Week day10:00-17:00
Please feel free to contact us from the following form for more detail.

Inquiry Form

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