HL-770 Automated Tray IC Lead / Mark Inspection System
A Professional Pick & Place Lead Scanner for ICs on Tray
Introduction
HL-770 system performs efficient and precised lead inspection, ball inspection,
mark inspection and surface inspection with accurate 3D optical measurements
for ICs on tray.
System operates two sets of Tray I/O alternatively with two independent
pick & place motion mechanisms. The lead scanning mechanism performs multi-unit
pick & place lead / ball scanning while the mark scanning / sorting mechanism
performs column-by-column mark / surface scanning as well as sorting and binning
of pass and fail units. This multi-task design makes system throughput up to
around 15K ~ 35K UPH for Tray In ? Tray Out operation and around 8K ~ 13K UPH
for Tray In ? Tape Out operation depending on IC package size.
Key features
<System function>
System performs lead and mark inspection for ICs on tray. Two sets of Tray I/O load trays onto
lead scanning area alternatively to perform multi-unit pick & place lead / ball scanning. Trays are then
moved to mark scanning / sorting area to perform column-by-column mark / surface scanning, failures
are then sorted to lead / mark failure trays while the vacancies are fed with spare passes and then moved
to Tray Out stack or optional Tape Out device via multi-unit pick & place tray-tape conversion.
<Lead / Ball inspection>
System provides 3D measurements of lead pitch, lead width, lead co-planarity, lead span, lead skew,
terminal dimension, standoff …etc. for TSOP, QFP… packages.
System also provides 3D measurements of ball pitch, ball diameter, ball co-planarity, ball offset,
ball height, ball shape, ball quality…etc. for BGA package.
<Mark / Surface inspection>
Either single marking criteria can be set for all characters or 3 different criteria can be individually set
for small, medium and large characters to screen out defects of double marking, low contrast marking,
voids or bleeds in the mark, broken or smeared characters...etc.
System also provides surface inspection to screen out body defects such as scratch, crack, chipout…etc.
<3D optical measurement>
The 3DX, accommodated with 3 high resolution digital cameras plus working with powerful I-Cite vision
software, provides the algorithms for high speed, accurate 3D image acquiring and measurement.
Sub-pixel algorithms maximize accuracy of measurements to 1/4 pixel.
<High throughput>
Parallel scanning and sorting, up to a third or a quarter of tray units each pick & place for scanning
and 10 units each pick & place for sorting / binning, visual scanning on the fly without having to stop
and position as well as extremely high speed image processing contribute system throughput up to
15K~35K UPH depending on IC package size.
<Statistical report>
System provides data collection report including yield summary, rejects summary and overall statistical
summary with detailed CPK data for Process and QA engineering.
Specification
| Motion | X-Y drive | High performance servo drive system |
| Transmission | Ball screw & linear guide mechanism | |
| Resolution | X axis: ±0.02mm, Y axis: ±0.03mm, Z axis: ±0.02mm | |
| Max. stroke | Mark / Lead scanning X axis: 203mm, Y axis: 910mm, Z axis: 20mm Sorting / Binning motion X axis: 513mm, Y axis: 918mm, Z axis: 12mm |
|
| Pick & Place | Scanning: Tool-free replaceable nozzle module. Nozzle matrix: 25 x 3 nozzles max. | |
| Sorting / binning | 10 nozzles with 12mm ~ 16mm variable pitch | |
| Vision | Camera | Fixed 3D cameras 2048 x 2048 pixels for lead / ball inspection (50mm x 50mm option) Fixed 3D cameras 1392 x 1040 pixels for lead / ball inspection (25mm x 25mm option) Carried 2D camera 1024 x 768 pixels for mark / surface inspection |
| Field of view | Optional 50mm x 50mm / 25mm x 25mm | |
| Image acquiring time | ~ 50 ms / image | |
| Image processing time | 30 ~ 60 ms / image | |
| Optical process speed | ~ 60K UPH (without handler index time) | |
| 3 sigma measurement accuracy | 5 ~ 7 um | |
| Applicable products | TSOP, QFP, BGA, QFN… etc. IC units packed in tray form | |
| Throughput | Tray to tray | 15K ~ 35K UPH (varied with package size and test yield) |
| Tray to tape | 8K ~ 13K UPH (varied with package size and test yield) | |
| I/O devices | Tray | Two Auto Tray devices for fresh and pass units. Stack up to 20~25 trays each Auto Tray Two Semi-auto Tray devices for spare passes and mark / lead failures |
| Tape Out Dual | Dual tape track with independent tape driver | |
| Accept tape with | 12 ~ 32 mm tape width | |
| Control | Built-in controller Vision | PC based control with I-Cite Vision software |
| Mechanism | PC based control with Visual C# software | |
| Display / Data entry | 17” LCD monitor / Keyboard / Mouse | |
| Power | AC voltage | 200 ~ 245V / 50-60Hz? Single phase |
| Power consumption | 1.6 KVA | |
| Air | Air pressure | 0.6 Mpa (~6.0 kg/cm2) |
| Air consumption | 250 liter/min | |
| Dimension | Base Unit | (W)1320mm x(D) 1590mm x (H)1600mm |
| Standard tray in - tray out setup | (W) 1760mm x (D) 2020mm x (H) 1600mm | |
| Optional tray in - tape out setup | (W) 2400mm x (D) 2020mm x (H)1600mm |
Inquiry
<Business Hour> Week day10:00-17:00
Please feel free to contact us from the following form for more detail.
